SMT Assembly
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Layers :8 Layer
Materials :FR4
Board Thickness :1.6mm
Soldmask :Green, Red, Blue, Black, White
Silk Screen : White
Pcb Standard :IPC-A-610 E Class II-III,IPC-II Standard
Name :PCBA Assembly
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Our surface mount technology utilizes high-speed Fuji NXT feeders and Mycronic MY500 systems for precision placement of 01005 chips to large BGAs. Nitrogen reflow ovens with closed-loop thermal profiling ensure voiding rates below 15%, while 3D SPI machines verify solder paste volume pre-reflow. This automated process guarantees exceptional repeatability for high-density designs in medical wearables, IoT modules, and communication devices where component miniaturization is critical.
